Blank Cover Image

Application of High and Low Wafer Bonding Processes for Bulk Micromachined Components

Author(s):
Publication title:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
99-35
Pub. Year:
1999
Page(from):
368
Page(to):
380
Pages:
13
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772587 [1566772583]
Language:
English
Call no.:
E23400/99-35
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Low-temperature approaches for fabrication of high-frequency microscanners

Hiller,K., Hahn,R., Kaufmann,C., Kurth,S., Kehr,K., Gessner,T., Dotzel,W., Wiemer,M., Schubert,I.

SPIE - The International Society for Optical Engineering
7 Conference Proceedings A novel 24-kHz resonant scanner for high-resolution laser display

Kurth, S., Kaufmann, C., Hahn, R., Mehner, J., Dotzel, W., Gessner, T.

SPIE - The International Society of Optical Engineering
2 Conference Proceedings Bonding and Metallization for a High Precision Acceleration Sensor

Gessner, T., Wiemer, M., Hiller, K., Hafen, M.

Electrochemical Society
8 Conference Proceedings Analogously working micromirror arrays

Kehr,K., Kurth,S., Mehner,J., Kaufmann,C., Hahn,R., Dotzel,W., Gessner,T.

SPIE - The International Society for Optical Engineering
3 Conference Proceedings Silicon mirror arrays fabricated by using bulk and surface micromachining

Gessner,T., Dotzel,W., Billep,D., Hahn,R., Kaufmann,C., Kehr,K., Kurth,S., Steiniger,C., Wollmann,U.

SPIE-The International Society for Optical Engineering
9 Conference Proceedings Reliability of MEMS devices in shock and vibration overload situations

S. Kurth, A. Shaporin, K. Hiller, C. Kaufmann, T. Gessner

Society of Photo-optical Instrumentation Engineers
4 Conference Proceedings Bonding and Contacting of MEMS-Structures on Wafer Level

Wiemer, M., Fromel, J., Jia, C., Gessner, T.

Electrochemical Society
10 Conference Proceedings Tunable Fabry-Perot interferometer for 3- to 4.5-μm wavelength with bulk micromachined reflector carrier

Kurth, S., Hiller, K., Neumann, N., Heinze, M., Doetzel, W., Gessner, T.

SPIE-The International Society for Optical Engineering
5 Conference Proceedings Wafer Bonding for Patterning of Micromechanical Sensors

Wierner, M., Hiller, K., Gessner, T.

Electrochemical Society
11 Conference Proceedings Bonding and deep RIE: a powerful combination for high-aspect-ratio sensors and actuators

Hiller, K., Kuchler, M., Billep, D., Schroter, B., Dienel, M., Scheibner, D., Gessner, T.

SPIE - The International Society of Optical Engineering
6 Conference Proceedings Fabrication of SOI Substrates with Buried Silicide Layers for BiCMOS Applications

Wiemer, M., Zimmermann, S., Zhao, Q.T., Trui, B., Kaufmann, C., Mantl, S., Dudek, V., Gessner, T.

Electrochemical Society
12 Conference Proceedings Performance and reliability test of MEMS optical scanners

S. Kurth, C. Kaufmann, R. Hahn, J. Mehner, W. Doetzel, T. Gessner

SPIE - The International Society of Optical Engineering
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12