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Application of High and Low Wafer Bonding Processes for Bulk Micromachined Components

Author(s):
Publication title:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
99-35
Pub. date:
1999
Page(from):
368
Page(to):
380
Pages:
13
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772587 [1566772583]
Language:
English
Call no.:
E23400/99-35
Type:
Conference Proceedings

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