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State of the Art Deep Silicon Anisotropic Etching on SOI Bonded Substrates for Dielectric Isolation and MEMS Applications

Author(s):
Gormley, C.
Yallup, K.
Nevin, W.A.
Bhardwaj, J.
Ashraf, H.
Huggett, P.
Blackstone, S.
2 more
Publication title:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
99-35
Pub. Year:
1999
Page(from):
350
Page(to):
361
Pages:
12
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772587 [1566772583]
Language:
English
Call no.:
E23400/99-35
Type:
Conference Proceedings

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