Oxidation Induced Crystalline Defects in Bonded SOI Wafers

Oxidation Induced Crystalline Defects in Bonded SOI Wafers

Author(s):

Papakonstantinou, P.

Publication title:

Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

99-35

Pub. Year:

1999

Page(from):

178

Page(to):

186

Pages:

9

Pub. info.:

Pennington, N.J.: Electrochemical Society

ISSN:

01616374

ISBN:

9781566772587 [1566772583]

Language:

English

Call no.:

E23400/99-35

Type:

Conference Proceedings

Details

TDL ID:	ZA00013963
Series ID:	PA00000028
Conf. info. (Name):	International Symposium on Wafer Bonding ; Fall Meeting of the Electrochemical Society
Conf. info. (Number):	5th ; 1999
Conf. info. (Venue):	Honololu. HI, USA
Conf. info. (Date):	1999.10.00

Similar Items:

1 Conference Proceedings State of the Art Deep Silicon Anisotropic Etching on SOI Bonded Substrates for Dielectric Isolation and MEMS Applications Gormley, C., Yallup, K., Nevin, W.A., Bhardwaj, J., Ashraf, H., Huggett, P., Blackstone, S. Electrochemical Society	7 Conference Proceedings Form C Opto-Solid State Relay on Bonded Wafer with 1600V Isolation Sinclair, P., Whitney, D., Taggart, W., Yallup, K., Blackstone, S. Electrochemical Society
2 Conference Proceedings Factors Affecting Stress-Induced Defect Generation in Trenched SOI for High-Voltage Applications Nevin, W.A., Somasundram, K., McCann, P., Cao, X., Byrne, S. Electrochemical Society	8 Conference Proceedings Fusion-Bonded Multilayered SOI for MEMS Applications Somasundram, K., McCann, P., Cole, D., McNamara, C., Boyle, A., Devine, C., Brown, A., Nevin, A. Electrochemical Society
3 Conference Proceedings Effect of Material Properties on Stress-Induced Defect Generation in Trench SOI Nevin, W.A., Somasundram, K., Blackstone, S., Magee, S., Paxton, A.T. Electrochemical Society	9 Conference Proceedings Fusion-bonded multilayer SOI for MEMS applications Somasundram, K., Cole, D., McNamara, C., Boyle, A., McCann, P., Devine, C., Nevin, A. SPIE-The International Society for Optical Engineering
4 Conference Proceedings Effect of Material Properties on Stress-Induced Defect Generation in Trench SOI Nevin,W.A., Somasundram,K., Blackstone,S., Magee,S., Paxton,A.T. Electrochemical Society, SPIE-The International Society for Optical Engineering	10 Conference Proceedings Fusion-bonded mutilayered SOI for MEMS applications Cole, D., McNamara, C., Somasundram, K., Boyle, A., Devine, C., MoKeever, J., McCann, P., Nevin, A. SPIE-The International Society for Optical Engineering
5 Conference Proceedings Bonded and Trenched SOI with Buried Silicide Layers McDonnell, B., Blackstone, S., Wilson, R., Quinn, C., Yallup, K. Electrochemical Society	11 Conference Proceedings Control of ciystalline defects in trench isolated thick film SOI for high voltage smart power ICs Cao, X., Nicholson, D., Nevin, W.A., Knopke, J. Electrochemical Society
6 Conference Proceedings Photoluminescence Study of Interface Defects in Bonded Silicon Wafers Nevin, W.A., Gay, D.L., Blackstone, S., Higgs, V. Electrochemical Society	12 Conference Proceedings Conformal deposition of LPCVD TEOS McCann,P., Somasundram,K., Byrne,S., Nevin,A. SPIE-The International Society for Optical Engineering

1

2

3

4

5

6

7

8

9

10

11

12