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Why Debonding is Useful in SOI

Author(s):
Cha, G.
Lee, S.H.
Park, H.J.
Lee, K.H.
Kang, H.S.
Song, C.S.
Kim, D.J.
Kim, Y.C.
Kim, S.K.
4 more
Publication title:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
99-35
Pub. Year:
1999
Page(from):
119
Page(to):
128
Pages:
10
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772587 [1566772583]
Language:
English
Call no.:
E23400/99-35
Type:
Conference Proceedings

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