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The Smart-Cut Process: Status and Developments

Author(s):
Aspar, B.
Lagahe, C.
Moriceau, H.
Jalaguier, E.
Mas, A.
Rayssac, O.
Biasse, Soubie; B.
Bruel, M.
Auberton-Hevre, A.J.
Barge, T.
Letertre, F.
Maleville, C.
7 more
Publication title:
Semiconductor wafer bonding : science, technology, and applications : proceedings of the international symposia
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
99-35
Pub. Year:
1999
Page(from):
48
Page(to):
59
Pages:
12
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772587 [1566772583]
Language:
English
Call no.:
E23400/99-35
Type:
Conference Proceedings

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