Simulation of Shape Evolution During Electrodeposition of Copper in the Presence of Additives

Simulation of Shape Evolution During Electrodeposition of Copper in the Presence of Additives

Author(s):

Publication title:

Fundamental aspects of electrochemical deposition and dissolution : proceedings of the international symposium

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

99-33

Pub. Year:

1999

Page(from):

405

Page(to):

412

Pages:

8

Pub. info.:

Pennington, New Jersey: Electrochemical Society

ISSN:

01616374

ISBN:

9781566772563 [1566772567]

Language:

English

Call no.:

E23400/99-33

Type:

Conference Proceedings

Details

TDL ID:	ZA00013961
Series ID:	PA00000028
Conf. info. (Name):	Symposium on Fundamental Aspects of Electrochemical Deposition and Dissolution
Conf. info. (Number):	1999
Conf. info. (Venue):	Honolulu, HI, USA
Conf. info. (Date):	1999.10.00

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