Study of Metal/Barrier/Low-K Interfaces for Interlayer Dielectric Applications

Study of Metal/Barrier/Low-K Interfaces for Interlayer Dielectric Applications

Author(s):

Chang, J.P.

Publication title:

Interconnect and contact metallization for ULSI : proceedings of the international symposium

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

99-31

Pub. Year:

1999

Page(from):

261

Page(to):

269

Pages:

9

Pub. info.:

Pennington, N.J.: Electrochemical Society

ISSN:

01616374

ISBN:

9781566772549 [1566772540]

Language:

English

Call no.:

E23400/99-31

Type:

Conference Proceedings

Details

TDL ID:	ZA00013959
Series ID:	PA00000028
Conf. info. (Name):	International symposium on interconnect and contact metallization for ULSI
Conf. info. (Number):	1999
Conf. info. (Venue):	Honolulu, HI, USA
Conf. info. (Date):	1999.10.17-1999.10.22

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