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Pulsed Electrodeposition of Copper from Alkaline and Acid Baths for Metallization in Integrated Circuits

Author(s):
Publication title:
Interconnect and contact metallization for ULSI : proceedings of the international symposium
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
99-31
Pub. Year:
1999
Page(from):
111
Page(to):
124
Pages:
14
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772549 [1566772540]
Language:
English
Call no.:
E23400/99-31
Type:
Conference Proceedings

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