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Evaluation of 02- and N2- Addition in Via Etching and CHF3/02 Post Etch Treatment

Author(s):
Ho, C.N.
Higelin, G.
Low, C.H.
See, A.
Chan, L.
Chua, D.H.C.
1 more
Publication title:
Plasma etching processes for sub-quarter micron devices : proceedings of the international symposium
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
99-30
Pub. Year:
1999
Page(from):
269
Page(to):
283
Pages:
15
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772532 [1566772532]
Language:
English
Call no.:
E23400/99-30
Type:
Conference Proceedings

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