New Borderless Contact Etch with Novel Chamber Condition
- Author(s):
- Publication title:
- Plasma etching processes for sub-quarter micron devices : proceedings of the international symposium
- Title of ser.:
- Electrochemical Society Proceedings Series
- Ser. no.:
- 99-30
- Pub. Year:
- 1999
- Page(from):
- 239
- Page(to):
- 245
- Pages:
- 7
- Pub. info.:
- Pennington, NJ: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566772532 [1566772532]
- Language:
- English
- Call no.:
- E23400/99-30
- Type:
- Conference Proceedings
Similar Items:
MRS - Materials Research Society |
Materials Research Society |
2
Conference Proceedings
Electrochemical and mechanical investigations of new fluorinated composites
SPIE-The International Society for Optical Engineering |
Electrochemical Society |
MRS - Materials Research Society |
SPIE-The International Society for Optical Engineering |
SPIE - The International Society of Optical Engineering |
SPIE - The International Society of Optical Engineering |
5
Conference Proceedings
RECENTDEVELOPMENTS IN THE EPITAXIAL GROWTH OF TRANSITION METAL SILICIDES ON SILICON
Kluwer Academic Publishers |
11
Conference Proceedings
REMOVAL OF END-OF-RANGE ION IMPLANTATION DEFECTS IN SILICON BY NEAR NOBLE AND REFRACTORY SILICDE FORMATION
Materials Research Society |
6
Conference Proceedings
An Optimized PECVD SiN Deposition for Borderless Contact Etch-Stop-Layer (ESL) of Sub-0.25 um Logic Devices
Electrochemical Society |
12
Conference Proceedings
Effect of Interface Native Oxide Layer on the Properties of Annealed Ni/SiC Contacts
Trans Tech Publications |