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Atomic-Order Side-Wail Passivation with Nitrogen in ECR Plasma Etching of Si

Author(s):
Publication title:
Plasma etching processes for sub-quarter micron devices : proceedings of the international symposium
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
99-30
Pub. Year:
1999
Page(from):
220
Page(to):
225
Pages:
6
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772532 [1566772532]
Language:
English
Call no.:
E23400/99-30
Type:
Conference Proceedings

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