Direct Correlation Between Defects and Thermal Stress in Rapid Thermal Processing

Direct Correlation Between Defects and Thermal Stress in Rapid Thermal Processing

Author(s):

Publication title:

Advances in rapid thermal processing : proceedings of the symposium

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

99-10

Pub. Year:

1999

Page(from):

163

Page(to):

170

Pages:

8

Pub. info.:

Pennington, N. J.: Electrochemical Society

ISSN:

01616374

ISBN:

9781566772327 [156677232X]

Language:

English

Call no.:

E23400/99-10

Type:

Conference Proceedings

Details

TDL ID:	ZA00013940
Series ID:	PA00000028
Conf. info. (Name):	International symposium on advances in rapid thermal processing ; Meeting of Electrochemical Society
Conf. info. (Number):	1999 ; 195th
Conf. info. (Venue):	Seattle, WA, USA
Conf. info. (Date):	1999.05.03-1999.05.06

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