The Use of Copper Based Backmetai Schemes As a Low Stress and Low Thermal Resistance Alternative for Use in Thin Substrate Power Devices

The Use of Copper Based Backmetai Schemes As a Low Stress and Low Thermal Resistance Alternative for Use in Thin Substrate Power Devices

Author(s):

Publication title:

Electrochemical processing in ULSI fabrication and semiconductor/metal deposition II : proceedings of the international symposium

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

99-9

Pub. Year:

1999

Page(from):

185

Page(to):

193

Pages:

9

Pub. info.:

Pennington, N.J.: Electrochemical Society

ISSN:

01616374

ISBN:

9781566772310 [1566772311]

Language:

English

Call no.:

E23400/99-9

Type:

Conference Proceedings

Details

TDL ID:	ZA00013939
Series ID:	PA00000028
Conf. info. (Name):	Symposium on Electrochemical processing in ULSI fabrication and semiconductor/metal deposition
Conf. info. (Number):	2nd
Conf. info. (Venue):	Seattle, Washington, USA
Conf. info. (Date):	1999.05.03-1999.05.06

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