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Model of Wafer Thickness Uniformity in an Electroplating Tool

Author(s):
Deligianni, H.
Dukovic, J.O.
Walton, E.G.
Contolini, R.J.
Reid, J.
Patton, E.
1 more
Publication title:
Electrochemical processing in ULSI fabrication and semiconductor/metal deposition II : proceedings of the international symposium
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
99-9
Pub. Year:
1999
Page(from):
83
Page(to):
95
Pages:
13
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772310 [1566772311]
Language:
English
Call no.:
E23400/99-9
Type:
Conference Proceedings

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