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Integrity of Copper-Tantalum Nitride Metallization Under Different Ambient Conditions

Author(s):
Yap, K.P.
Gong, H.
Dai, J.Y.
Osipowicz, T.
Chan, L.H.
Lahiri, S.K.
1 more
Publication title:
Low and High Dielectric Constant Materials : Materials Science, Processing, and Reliability Issues, proceedings of the fourth International Symposium and Thin Film Materials for Advanced Packaging Technologies : proceedings of the second International Symposium
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
99-7
Pub. Year:
1999
Page(from):
195
Page(to):
208
Pages:
14
Pub. info.:
Pennington, N.J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772297 [156677229X]
Language:
English
Call no.:
E23400/99-7
Type:
Conference Proceedings

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