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Low Temperature HF Bonding and Micropackaging for Microsystems

Author(s):
Ike, S.
Shoji, S.
Kudo, H.
Nakamura, R.
Saitoh, T.
Nakanishi, H.
Nishimoto, T.
2 more
Publication title:
Proceedings of the International Symposium on Microstructures and Microfabricated Systems IV
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
98-14
Pub. Year:
1998
Page(from):
70
Page(to):
76
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772068 [1566772060]
Language:
English
Call no.:
E23400/98-14
Type:
Conference Proceedings

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