Blank Cover Image

Impact of Slurry Particle Aggregation upon Pad Surface Topography and Film Removal Rate in Chemical Mechanical Planarization

Author(s):
Publication title:
Proceedings of the Second International Symposium on Chemical Mechanical Planariarization [sic] in Integrated Circuit Device Manufacturing
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
98-7
Pub. Year:
1998
Page(from):
197
Page(to):
205
Pub. info.:
Pennington, N. J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772013 [156677201X]
Language:
English
Call no.:
E23400/98-7
Type:
Conference Proceedings

Similar Items:

Devriendt, ft., Grilaert, J., Heylen, N., Holl, K., Meuris, M., Yang, J., Zhong, L.

Materials Research Society

John Kelchner

American Institute of Chemical Engineers

M.L. White, S. Reggie, N. Naguib, K. Nicholson, J. Gilliland

Trans Tech Publications

John Kelchner

American Institute of Chemical Engineers

Obeng, Y., Deshpande, S., Kuiry, S.C., Dakshinamurthy, S., Chamma, K., Vaidyanathan, R., Richardson, K., Seal., S.

Electrochemical Society

Sainio, C.A., Duquette, D.J.

Electrochemical Society

Remsen, Edward E., Anjur, Sriram P., Boldridge, David, Kamiti, Mungai, Li, Shoutian

Materials Research Society

Zhang, F., Wake, R.W., Cook, L., Busnaina, A.A.

Electrochemical Society

YYamamoto, uichi, Kozuki, Takaaki, Shibuki, Shunichi, Maeda, Keiichi, Inoue, Yasuaki, Tawara, Shinji, Toge, Naoki

Materials Research Society

Philipossian, Ara, Mitchell, Erin

Materials Research Society

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12