Chemical-Mechanical Polishing of Metals: the Role of Metal Concentration Gradient

Chemical-Mechanical Polishing of Metals: the Role of Metal Concentration Gradient

Author(s):: Osseo-Asare, K.
Publication title:: Proceedings of the Second International Symposium on Chemical Mechanical Planariarization [sic] in Integrated Circuit Device Manufacturing
Title of ser.:: Electrochemical Society Proceedings Series
Ser. no.:: 98-7
Pub. Year:: 1998
Page(from):: 173
Page(to):: 180
Pub. info.:: Pennington, N. J.: Electrochemical Society
ISSN:: 01616374
ISBN:: 9781566772013 [156677201X]
Language:: English
Call no.:: E23400/98-7
Type:: Conference Proceedings

Details

TDL ID:	ZA00013910
Series ID:	PA00000028
Conf. info. (Name):	International Symposium on Chemical Mechanical Planarization ; Annual Meeting of Electrochemical Society
Conf. info. (Number):	2nd ; 193rd
Conf. info. (Venue):	San Diego, CA, USA
Conf. info. (Date):	1998.05.05-1998.05.07

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