Chemical-Mechanical Polishing of Tungsten: An Electrophoretic Mobility Investigation of Alumina-Tungstate Interactions

Chemical-Mechanical Polishing of Tungsten: An Electrophoretic Mobility Investigation of Alumina-Tungstate Interactions

Author(s):

Publication title:

Proceedings of the Second International Symposium on Chemical Mechanical Planariarization [sic] in Integrated Circuit Device Manufacturing

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

98-7

Pub. Year:

1998

Page(from):

139

Page(to):

144

Pub. info.:

Pennington, N. J.: Electrochemical Society

ISSN:

01616374

ISBN:

9781566772013 [156677201X]

Language:

English

Call no.:

E23400/98-7

Type:

Conference Proceedings

Details

TDL ID:	ZA00013910
Series ID:	PA00000028
Conf. info. (Name):	International Symposium on Chemical Mechanical Planarization ; Annual Meeting of Electrochemical Society
Conf. info. (Number):	2nd ; 193rd
Conf. info. (Venue):	San Diego, CA, USA
Conf. info. (Date):	1998.05.05-1998.05.07

Similar Items:

1 Conference Proceedings Concentration Gradient Effects in Tungsten Chemical Mechanical Polishing Anik, M., Osseo-Asare, K. Electrochemical Society	7 Conference Proceedings Cathodic Reactions in Copper Chemical Mechanical Polishing: The Cu/Fe3+ and Cu/H202 Systems Al-Hinai, Ashraf T., Osseo-Asare, Kwadwo Electrochemical Society
2 Conference Proceedings Oxidation and Dissolution Characteristics of Tungsten: Application To Chemical Mechanical Polishing Anik, M., Osseo-Asare, K. Electrochemical Society	8 Conference Proceedings Tungsten CMP: Reduction Behavior of Iodate Ion on Tungsten Anik, M., Osseo-Asare, K. Electrochemical Society
3 Conference Proceedings Colloids and Surfaces in Chemical Mechanical Polishing: An Adsorptive Model for Abrasive Particle/Oxide Substrate Interactions Osseo-Asare, K. Electrochemical Society	9 Conference Proceedings Estimation of W Polishing Characteristics During W-CMP with Iodate-Based Slurries Anik, M., Osseo-Asare, K. Electrochemical Society
4 Conference Proceedings Chemical-Mechanical Polishing of Metals: the Role of Metal Concentration Gradient Osseo-Asare, K. Electrochemical Society	10 Conference Proceedings Kinetics of the Formation of Cu(I)BTA Films Al-Hinai, A., Osseo-Asare, K. Electrochemical Society
5 Conference Proceedings Aqueous Slurries in Chemical Mechanical Polishing: Adsorption of Silicate Ions by Ceria Osseo-Asare, K., Suphantharida, P. Electrochemical Society	11 Conference Proceedings Mechanistic Aspects of Chemical Mechanical Polishing of Tungsten Using Ferric Ion Based Alumina Slurries Raghunath, C., Lee, K.T., Kneer, E.A., Mathew, V., Raghavan, S. Electrochemical Society
6 Conference Proceedings Cerium Oxide Slurries in Chemical Mechanical Polishing: Silica/Ceria Interactions Suphantharida, P., Osaco-Asare, K. Electrochemical Society	12 Conference Proceedings CHEMICAL-MECHANICAL POLISHING OF TUNGSTEN WITH HOLOGEN-BASED SLURRIES Yang, K., Gutmann, R. J., Murarka, S. P., Stonebaker, E., Atkins, H. MRS - Materials Research Society

1

2

3

4

5

6

7

8

9

10

11

12