A Cautious Approach to the Removal of Ta in the CMP Polishing of Cu-Ta Structures

A Cautious Approach to the Removal of Ta in the CMP Polishing of Cu-Ta Structures

Author(s):

Publication title:

Proceedings of the Second International Symposium on Chemical Mechanical Planariarization [sic] in Integrated Circuit Device Manufacturing

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

98-7

Pub. Year:

1998

Page(from):

119

Page(to):

125

Pub. info.:

Pennington, N. J.: Electrochemical Society

ISSN:

01616374

ISBN:

9781566772013 [156677201X]

Language:

English

Call no.:

E23400/98-7

Type:

Conference Proceedings

Details

TDL ID:	ZA00013910
Series ID:	PA00000028
Conf. info. (Name):	International Symposium on Chemical Mechanical Planarization ; Annual Meeting of Electrochemical Society
Conf. info. (Number):	2nd ; 193rd
Conf. info. (Venue):	San Diego, CA, USA
Conf. info. (Date):	1998.05.05-1998.05.07

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