Blank Cover Image

CMP Applications for Sub-0.25μm Process Technologies

Author(s):
Publication title:
Proceedings of the Second International Symposium on Chemical Mechanical Planariarization [sic] in Integrated Circuit Device Manufacturing
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
98-7
Pub. date:
1998
Page(from):
1
Page(to):
8
Pub. info.:
Pennington, N. J.: Electrochemical Society
ISSN:
01616374
ISBN:
9781566772013 [156677201X]
Language:
English
Call no.:
E23400/98-7
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Dual Salicide and Self-aligned Metal Gate Formation for Sub-0.25μm CMOS Technologies Using CMP

Weling, M., Lin, X.-W.

Electrochemical Society
7 Conference Proceedings Self-Aligned Gate Metallization Processes With Low-Thermal Budget

Lin, X. W., Weling, M.

MRS - Materials Research Society
2 Conference Proceedings Integration of CMP into Deep Sub-Micron Multilevel Metallization Circuits

Pramanik, D., Weling, M.

Electrochemical Society
8 Conference Proceedings Integration Challenges of Inorganic Low-K (K < 2.5) Materials With Cu for Sub-0.25)μm Multilevel Interconnects

Blumenthal, R., Braekelmann, G., Cave, N. G., Conner, J., Crabtree, P., Defilippi, J., Denning, D., Farkas, J., …

Materials Research Society
3 Conference Proceedings Dielectric CMP Planarization Considerations for Deep Sub-Micron Multilevel Interconnect Processes

Weling, M., Bothra, S., Qian, L., Sethi, S., Pramanik, D.

Electrochemical Society
9 Conference Proceedings "2.5-V, 1-Gb/s/ch parallel optical receiver in 0.25-μm CMOS technology"

Jung,S.-J., Kim,H.-S., Kim,D.-G., Choi,Y.-W.

SPIE-The International Society for Optical Engineering
4 Conference Proceedings CMP Integration Issues for Sub-0.l5μm Process Technologies

Weling, Milind, Dunton, Vance, Zhang, Liming, Annapragada, Rao

Electrochemical Society
10 Conference Proceedings Parasitic Resistance Considerations of Using Elevated Source/Drain for Sub-0.25 μm MOSFET Technology

Sun, J., Srivastava, A., Bartholomew, R.F., Bellur, K., Osburn, C.M., Masnari, N.A.

Electrochemical Society
5 Conference Proceedings Silicon Nitride Polish-Stop for CMP of BPSG Films on sub-0.25μm DRAMs

Stephens, J., Dobuzinsky, D., Gambina, J., Glashauser, W., Huckels, K., Hanebeck, J., Kraxenberger, M., Naeem, M., Rupp, …

Electrochemical Society
11 Conference Proceedings Proven Extendibility of Low Damage Cu-CMP Process for Sub-0.13 μm ULSI Interconnects

Tsai, T.C., flu, S.C., Lin, Z.H., Hsu, S.H., Hsu, C.L., Dai, J., Yang, F., Lin, M.H., Chen, H.C., Hsieh, W.Y.

Electrochemical Society
6 Conference Proceedings CVD Tungsten Via Void Minimization for Sub 0.25 μm Technology

Haider, A.M., Rose, D.J., Dehord, J.R.D., Zuhoski, S.P.

Electrochemical Society
12 Conference Proceedings Self-aligned silicide process technology for sub-0.25-ｦﾌm geometries

White,T.R., Kolar,D., Jahanbani,M., Frisa,L.E., Nagabushnam,R., Chuang,H., Tsui,P., Cope,J., Pulvirent,L., Bolton,S.

SPIE-The International Society for Optical Engineering
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12