Modeling of Electromigration-Induced Failure of Metallic Thin Films Interconnects

Modeling of Electromigration-Induced Failure of Metallic Thin Films Interconnects

Author(s):

Publication title:

Proceedings of the Symposia on Electrochemical Processing in ULSI Fabrication I and Interconnect and Contact Metallization: materials, processes, and reliability

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

98-6

Pub. Year:

1998

Page(from):

232

Page(to):

243

Pages:

12

Pub. info.:

Pennington, N.J.: Electrochemical Society

ISSN:

01616374

ISBN:

9781566772006 [1566772001]

Language:

English

Call no.:

E23400/98-6

Type:

Conference Proceedings

Details

TDL ID:	ZA00013909
Series ID:	PA00000028
Conf. info. (Name):	Symposia on Electrochemical Processing in ULSI Fabrication ; Meeting of the Electrochemical Society ; Interconnect and Contact Metallization: Materials, Processes, and Reliability ; Meeting of the Electrochemical Society
Conf. info. (Number):	1st ; 193rd ; 1998 ; 194th
Conf. info. (Venue):	San Diego, CA, USA ; San Diego, CA, USA ; Boston, MA, USA ; Boston, MA, USA
Conf. info. (Date):	1998.05.04-1998.05.05 ; 1998.05.04-1998.05.05 ; 1998.11.01-1998.11.06 ; 1998.11.01-1998.11.06

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