Deposition of Low-k Dielectric Films Using Trimethylsilane

Deposition of Low-k Dielectric Films Using Trimethylsilane

Author(s):

Publication title:

Proceedings of the Symposia on Electrochemical Processing in ULSI Fabrication I and Interconnect and Contact Metallization: materials, processes, and reliability

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

98-6

Pub. Year:

1998

Page(from):

145

Page(to):

152

Pages:

8

Pub. info.:

Pennington, N.J.: Electrochemical Society

ISSN:

01616374

ISBN:

9781566772006 [1566772001]

Language:

English

Call no.:

E23400/98-6

Type:

Conference Proceedings

Details

TDL ID:	ZA00013909
Series ID:	PA00000028
Conf. info. (Name):	Symposia on Electrochemical Processing in ULSI Fabrication ; Meeting of the Electrochemical Society ; Interconnect and Contact Metallization: Materials, Processes, and Reliability ; Meeting of the Electrochemical Society
Conf. info. (Number):	1st ; 193rd ; 1998 ; 194th
Conf. info. (Venue):	San Diego, CA, USA ; San Diego, CA, USA ; Boston, MA, USA ; Boston, MA, USA
Conf. info. (Date):	1998.05.04-1998.05.05 ; 1998.05.04-1998.05.05 ; 1998.11.01-1998.11.06 ; 1998.11.01-1998.11.06

Similar Items:

1 Conference Proceedings Using Trimethylsilane to Improve Safety, Throughput and Versatility in PECVD processes Loboda, M.J., Seifferly, J.A., Grove, C.M., Schneider, R.F. Electrochemical Society	7 Conference Proceedings Growth and Characterization of N-Doped SiC Films from Trimethylsilane Chen, J., Steckl, A. J., Loboda, M. J. Trans Tech Publications
2 Conference Proceedings The Influence of Temperature on the Deposition of Low-k Films by PECVD of Trimethylsilane Hwang, B.K., Loboda, M.J., Cerny, G., Schneider, R., Seifferly, J. Electrochemical Society	8 Conference Proceedings Thin film dielectrics for electronics using combustion chemical vapor deposition Lin, W-Y., Huang, H., Cullen, D. K., Shoup, S. S., Cousins, D., Schmitt, J. J., Hunt, A. T., Romanofsky, R. R., … MRS-Materials Research Society
3 Conference Proceedings Safe Precursor Gas for Broad Replacement of SiH4 in Plasma Processes Employed in Integrated Circuit Production Loboda, M. J., Seifferly, J. A., Grove, C. M., Schneider, R. F. MRS - Materials Research Society	9 Conference Proceedings Low Temperature Deposition of Ferromagnetic Ni-Mn-Ga Thin Films From Two Different Targets via RF Magnetron Sputtering A.C. Lourenço, F. Figueiras, S. Das, J.S. Amaral, G.N. Kakazei, D.V. Karpinsky, N. Soares, M. Peres, M.J. Pereira, P.B. … Materials Research Society
4 Conference Proceedings PLASMA ETCHING AND SURFACE ANALYSIS OF a-SiC:H FILMS DEPOSITED BY LOW TEMPERATURE PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION Thomas, J. H., III, Loboda, M. J., Seifferly, J. A. MRS - Materials Research Society	10 Conference Proceedings RF AEROSOL MIST PLASMA DEPOSITION OF OXIDE FILMS Williams, J. A. A., Shen, C. Q., Vuong, K. D., Tenpas, E., Condrate, R. A., Sr., Lee, D. H., Wang, H., Fagan, J., Wang, … MRS - Materials Research Society
5 Conference Proceedings Characterization of Ashing Effects on Low-k Dielectric Films Shepherd, R.A., Nguyen, D., Cerny, G., Loboda, M.J. Electrochemical Society	11 Conference Proceedings Analysis of Dislocation Behavior in Low Dislocation Density, PVT-Grown, Four-Inch Silicon Carbide Single Crystals M. Dudley, S. Byrappa, H. Wang, F. Wu, Y. Zhang, B. Raghothamachar, G. Choi, E.K. Sanchez, D. Hansen, R. Drachev, M.J. … Materials Research Society
6 Conference Proceedings HIGH GROWTH RATE OF SILICON CARBIDE ON SILICON (111) SUBSTRATES BY CHEMICAL VAPOR DEPOSITION USING TRIMETHYLSILANE Madapura, S., Steckl, A.J., Loboda, M. Electrochemical Society	12 Conference Proceedings A study on Low Dielectric Material Deposition Using a Helicon Plasma Source Choi, C-K., Oh, Y.J., Lee, K-M, Kim, J-H., Chang, H-Y., Kang, S-W. Electrochemical Society

1

2

3

4

5

6

7

8

9

10

11

12