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STRESS ANALYSIS OF LARGE DIAMETER SILICON WAFERS UNDER THERMAL PROCESSING

Author(s):
Xin, P.  
Publication title:
Silicon materials science and technology : proceedings of the Eighth International Symposium on Silicon Materials Science and Technology
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
98-1(1)
Pub. date:
1998
Page(from):
660
Page(to):
670
Pages:
11
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566771931 [1566771935]
Language:
English
Call no.:
E23400/98-1
Type:
Conference Proceedings

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