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ROOM TEMPERATURE COPPER OUT-DIFFUSION FROM THE BULK OF SILICON WAFERS AND ITS BEHAVIOR FOLLOWING VARIOUS POSTANNEAL TREATMENTS

Author(s):
Publication title:
Silicon materials science and technology : proceedings of the Eighth International Symposium on Silicon Materials Science and Technology
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
98-1(1)
Pub. date:
1998
Page(from):
629
Page(to):
640
Pages:
12
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566771931 [1566771935]
Language:
English
Call no.:
E23400/98-1
Type:
Conference Proceedings

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