Backside Imaging CCD using Bonded and Etched Back Silicon on Epoxy
- Author(s):
- Publication title:
- Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications
- Title of ser.:
- Electrochemical Society Proceedings Series
- Ser. no.:
- 97-36
- Pub. Year:
- 1997
- Page(from):
- 584
- Page(to):
- 591
- Pub. info.:
- Pennington, NJ: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566771894 [1566771897]
- Language:
- English
- Call no.:
- E23400/97-36
- Type:
- Conference Proceedings
Similar Items:
SPIE-The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |
Electrochemical Society |
8
Conference Proceedings
Experimental Study of Etched Back Thermal Oxide for Optimization of the Si/High-k Interface
Materials Research Society |
SPIE - The International Society for Optical Engineering |
Materials Research Society |
Trans Tech Publications |
10
Conference Proceedings
Theoretical basis and experimental confirmation:why a CMOS imager is superior to a CCD
SPIE - The International Society for Optical Engineering |
SPIE-The International Society for Optical Engineering |
SPIE - The International Society of Optical Engineering |
SPIE-The International Society for Optical Engineering |
12
Conference Proceedings
Backside-illuminated 6.6-ヲフm pixel video-rate CCDS for scientific imaging applications
SPIE - The International Society for Optical Engineering |