Backside Imaging CCD using Bonded and Etched Back Silicon on Epoxy

Backside Imaging CCD using Bonded and Etched Back Silicon on Epoxy

Author(s):

Publication title:

Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

97-36

Pub. Year:

1997

Page(from):

584

Page(to):

591

Pub. info.:

Pennington, NJ: Electrochemical Society

ISSN:

01616374

ISBN:

9781566771894 [1566771897]

Language:

English

Call no.:

E23400/97-36

Type:

Conference Proceedings

Details

TDL ID:	ZA00013898
Series ID:	PA00000028
Conf. info. (Name):	International Symposium on Semiconductor Wafer Bonding
Conf. info. (Number):	4th
Conf. info. (Venue):	Paris, France
Conf. info. (Date):	1997.00.00

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