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Design Considerations for SI and SIC Layer Transfer by H-Implantation

Author(s):
Tong, Q.-Y.
Lee, T.-H.
Huang, L.-J.
Chao, Y.-L.
Kim, W.J.
Scholz, R.
Tan, T.Y.
Goesele, U.
3 more
Publication title:
Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
97-36
Pub. Year:
1997
Page(from):
521
Page(to):
528
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566771894 [1566771897]
Language:
English
Call no.:
E23400/97-36
Type:
Conference Proceedings

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