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Interchip Via Technology-Three Dimensional Metallization for Vertically Integrated Circuits

Author(s):
Bertagnolli, E.
Dollmann, D.
Braun, R.
Buchner, R.
Engelhardt, M.
Grassl, T.
Hieber, K.
Kawala, G.
Kleiner, M.
Klump, A.
Kuehn, S.
Landesberger, C.
Pamler, W.
Popp, R.
Ramm, P.
Renner, E.
Ruhl, G.
Saenger, A.
Scheler, U.
Schmidt, C.
Schwarzl, S.
Weber, J.
17 more
Publication title:
Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
97-36
Pub. Year:
1997
Page(from):
509
Page(to):
520
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566771894 [1566771897]
Language:
English
Call no.:
E23400/97-36
Type:
Conference Proceedings

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