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Vertical Polysilicon Interconnects by Aligned Wafer Bonding

Author(s):
Harendt, C.
Schuhbauer, A.
Apel, U.
Dudek, V.
Graf, H.-G.
Hoefflinger, B.
Penteker, E.
2 more
Publication title:
Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
97-36
Pub. date:
1997
Page(from):
501
Page(to):
508
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566771894 [1566771897]
Language:
English
Call no.:
E23400/97-36
Type:
Conference Proceedings

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