Blank Cover Image

A High-Voltage Bipolar Process using 6-Inch Direct Bonding Wafer for ASIC Line

Author(s):
Publication title:
Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
97-36
Pub. Year:
1997
Page(from):
493
Page(to):
500
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566771894 [1566771897]
Language:
English
Call no.:
E23400/97-36
Type:
Conference Proceedings

Similar Items:

Unno, H., Imai, K.

Electrochemical Society

Chandra, S., Nagasawa, H.

SPIE-The International Society for Optical Engineering

Cha, G., Kim, Y., Jang, H., Kang, H., Song, C.

SPIE-The International Society for Optical Engineering

A. Isohashi, Y. Sano, T. Kato, K. Yamauchi

Trans Tech Publications

N. Ishibashi, K. Fukada, A. Bandoh, K. Momose, H. Osawa

Trans Tech Publications

Mitlehner, H., Friedrichs, P., Elpelt, R., Dohnke, K.O., Schorner, R., Stephani, D.

Trans Tech Publications

Puff,W., Mascher,P., Hahn,S., Cho,K.H., Lee,B.Y.

Trans Tech Publications

R. Gunther, M. Ackermann, R. Partapsing, M. Collon, K. Wallace

Electrochemical Society

B. Aspar, C. Lagahe-Blanchard, N. Sousbie, J. Margail, H. Moriceau

Electrochemical Society

11 Conference Proceedings Direct Bonding of Oxidized Cavity Wafers

M.O. Palokangas, J. Dekker, K. Henttinen, J. Mäkinen

Electrochemical Society

Fournel, F., Monceau, H., Leroy, F., Eymery, J., Gentile, P., Rosseau, K., Rouviere, J.-L.

Electrochemical Society

Imai,Y., Tanaka,K.

SPIE - The International Society for Optical Engineering

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12