Silicon Wafer Bonding at Room Temperature by Ar Beam Surface Activation in Vacuum

Author(s):

• Takagi, H.
• Maeda, R.
• Chung, T.R.
• Suga, T.

Publication title:

Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

97-36

Pub. Year:

1997

Page(from):

393

Page(to):

400

Pub. info.:

Pennington, NJ: Electrochemical Society

ISSN:

01616374

ISBN:

9781566771894 [1566771897]

Language:

English

Call no.:

E23400/97-36

Type:

Conference Proceedings