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Mechanistic Studies of Silicon Wafer Bonding and Layer Exfoliation

Author(s):
Weldon, M.K.
Marsico, V.E.
Chabal, Y.J.
Agarwal, A.
Eaglesham, D.J.
Sapjeta, J.
Brown, W.L.
Jacobson, D.C.
Caudano, Y.
Christman, S.B.
Chaban, E.E.
6 more
Publication title:
Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
97-36
Pub. Year:
1997
Page(from):
229
Page(to):
248
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566771894 [1566771897]
Language:
English
Call no.:
E23400/97-36
Type:
Conference Proceedings

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