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Electrostatic Bonding for Silicon on Glass Applications

Author(s):
Baine, P.T.
Quinn, L.J.
Lee, B.
Mitchell, S.J.N.
Gamble, H.S.
Armstrong, B.M.
1 more
Publication title:
Proceedings of the Fourth International Symposium on Semiconductor Wafer Bonding : science, technology, and applications
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
97-36
Pub. Year:
1997
Page(from):
214
Page(to):
221
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566771894 [1566771897]
Language:
English
Call no.:
E23400/97-36
Type:
Conference Proceedings

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