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Statistical Modeling and Experimental Verification of Electromigration Time to Fail Distribution in Metal Interconnects

Author(s):
Capasso, C.
Gall, M.
Anderson, S.
Jawarani, D.
Hernandez, R.
Kawasaki, H.
1 more
Publication title:
Proceedings of the Symposium on Interconnect and Contact Metallization
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
97-31
Pub. date:
1997
Page(from):
196
Page(to):
202
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566771849 [1566771846]
Language:
English
Call no.:
E23400/97-31
Type:
Conference Proceedings

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