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29. Fundamental Shift in ULSI Interconnect Technology - Electrochemical Deposition of Cu for on Chip Interconnects

Author(s):
Publication title:
Proceedings of the Symposium on Fundamental Aspects of Electrochemical Deposition and Dissolution Including Modeling
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
97-27
Pub. Year:
1997
Page(from):
321
Page(to):
335
Pages:
15
Pub. info.:
Pennington, New Jersey: Electrochemical Society
ISSN:
01616374
ISBN:
9781566771801 [1566771803]
Language:
English
Call no.:
E23400/97-27
Type:
Conference Proceedings

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