Blank Cover Image

Gettering of Cu to voids induced by H+ implantation in SIMOX substrate

Author(s):
Publication title:
Proceedings of the Eighth International Symposium on Silicon-on-Insulator Technology and Devices
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
97-23
Pub. Year:
1997
Page(from):
86
Page(to):
91
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566771764 [1566771765]
Language:
English
Call no.:
E23400/97-23
Type:
Conference Proceedings

Similar Items:

Lourenco, M.A., Homewood, K.P., Hemment, P.L.F.

Materials Research Society

C. Lin, Z.Y. Zhou, X.Q. Li, S. Zou, P.L.F. Hemment

Society of Photo-optical Instrumentation Engineers

Giles, L.F., Nejim, A., Cristiano, F., Hemment, P.L.F.

Electrochemical Society

Zhang, J.P., Hemment, P.L.F., Newstead, S.M., Powell, A.R., Whall, T.E., Parker, E.H.C.

Electrochemical Society

Kilner, J. A., Chater, R. J., Biswas, S., Hemment, P. L. F., Reeson, K. J.

Materials Research Society

Hatzopoulos, N., Siapkas, D.I., Katsidis, C.C., Zorba, T., Hemment, P.L.F.

Electrochemical Society

Hemment, P.L.F.

Materials Research Society

Hall, S., Buiu, O., Mitrovic, I.Z., Mubarek, H.A. W. El, Ashburn, P., Bain, M., Gamble, H.S., Wang, Y., Hemment, P.L.F., …

Kluwer Academic Publishers

Giles, L.F., Meyyappan, N., Nejim, A., Blake, J., Cristiano, F., Hemment, P.L.F.

Electrochemical Society

HOBBS,A., BARKLIE,R.C., REESON,K., HEMMENT,P.L.F.

Trans Tech Publications

Hatzopoulos, N., Siapkas, D.I., Hemment, P.L.F., Skorupa, W.

Electrochemical Society

Celler, G.K., Hemment, P.L.F., West, K.W., Gibson, J.M.

Materials Research Society

1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12