Blank Cover Image

Silicon on quartz by a smarter cut process

Author(s):
Publication title:
Proceedings of the Eighth International Symposium on Silicon-on-Insulator Technology and Devices
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
97-23
Pub. Year:
1997
Page(from):
27
Page(to):
32
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566771764 [1566771765]
Language:
English
Call no.:
E23400/97-23
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings A MODEL FOR BLISTERING AND SPLITI'ING OF HYDROGEN IMPLANTED SILICON AND ITS APPLICATION TO SILICON-ON-QUARTZ

Huang, L.-J., Tong, Q.-Y., Lee, T.-H., Chao, Y.-L., Goesele, U.M.

Electrochemical Society
7 Conference Proceedings INTERFACIAL STRUCTURE OF BONDED SILICON WAFERS

Reiche, M., Goesele, U., Tong, Q.-Y.

Electrochemical Society
2 Conference Proceedings Design Considerations for SI and SIC Layer Transfer by H-Implantation

Tong, Q.-Y., Lee, T.-H., Huang, L.-J., Chao, Y.-L., Kim, W.J., Scholz, R., Tan, T.Y., Goesele, U.

Electrochemical Society
8 Conference Proceedings The Smart-Cut Process: Status and Developments

Aspar, B., Lagahe, C., Moriceau, H., Jalaguier, E., Mas, A., Rayssac, O., Biasse, Soubie; B., Bruel, M., Auberton-Hevre, …

Electrochemical Society
3 Conference Proceedings μ-Raman Spectra Analysis of the Evolution of Hydrogen Related Defects and Void Formation in the Silicon Ion-Cut Process

Dungen, W., Job, R., Ma, Y., Huang, Y.L., Fahrner, W.R., Keller, L.O., Horstmann, J.T.

Materials Research Society
9 Conference Proceedings Surface Modifications of Dense ZrO2-CeO2-CaO Membranes

Lee, T.H., Yang, Y.L., Jacobson, A.J.

Electrochemical Society
4 Conference Proceedings Critical Bonding Energy Required for Hydrogen-Implantation Induced Layer Splitting

Huang, L.-J., Tong, Q.-Y., Goesele, U.M.

Electrochemical Society
10 Conference Proceedings SiC SOI structures by direct carbonization conversion and direct growth from silacyclobutame

Steckl, A.J., Yuan, C., Tong, Q.Y., Goesele, U., Loboda, M.J.

Electrochemical Society
5 Conference Proceedings Process Design of Low Temperature Wafer Bonding

Tong, Q-Y., Goesele, U.

Electrochemical Society
11 Conference Proceedings Physical phenomena involved in the Smart Cut process

Moleville, C, Aspar, B, Powneyrol, T, Moriceau, H, Bract, M, Auberton-Herve, A J, Barge, T, Metral, F

Electrochemical Society
6 Conference Proceedings Application of Direct Bonding to the Fabrication of Si/ZnS Composite Infrared Windows

Feng, T., Tong, Q-Y., Askinazi, J., Goesele, U.

Electrochemical Society
12 Conference Proceedings Unibond SOI wafers achieved by Smart-Cut process

Bruel, M., Aspar, B., Maleville, C., Moriceau, H., Auberton-Herve, A.J., Barge, T.

Electrochemical Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12