Blank Cover Image

Integration of Electroless Cu and CoWP Multilayers in Damascene Process

Author(s):
Publication title:
Proceedings of the Second International Symposium on Low and High Dielectric Constant Materials : Materials Science, Processing, and Reliability Issues
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
97-8
Pub. Year:
1997
Page(from):
186
Page(to):
195
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566771351 [1566771358]
Language:
English
Call no.:
E23400/97-8
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings Electroless CoWP Barrier/Protection Layer Deposition for Cu Metallization

Lopatin, S., Shacham-Diamand, Y., Dubin, V., Vasudev, P. K., Pellerin, J., Zhao, B.

MRS - Materials Research Society
7 Conference Proceedings Sub-Half Micron Electroless Cu Metallization

Dubin, V. M., Shacham-Diamand, Y., Zhao, B., Vasudev, P. K., Ting, C. H.

MRS - Materials Research Society
2 Conference Proceedings Electroless Cu and barrier layers for subhalf-micron multilevel interconnects

Lopatin,S., Shacham-Diamand,Y., Dubin,V., Vasudev,P.K.

SPIE-The International Society for Optical Engineering
8 Conference Proceedings Electrochemical and Material Study of Electroless Ternary Barriers for Copper Interconnects

Lopatin, S., Kim, Y., Shacham-Diamand, Y.

MRS - Materials Research Society
3 Conference Proceedings Thin electroless barrier for copper films

Lopatin,S.D., Shacham-Diamand,Y.Y., Dubin,V.M., Kim,Y.S., Vasudev,P.K.

SPIE-The International Society for Optical Engineering
9 Conference Proceedings Material Properties of Electroless 100-200 nm Thick CoWP Films

Shacham-Diamand, Y., Sverdlov, Y., Petrov, N., Zhou, L., Croitoru, N., Inberg, A., Gileadi, E., Kahn, A., Eizenberg, M.

Electrochemical Society
4 Conference Proceedings Interaction between the Electroless Copper Deposition Solution and the Low-k Fluorinated Dielectrics

Hsu, D.T., Tong, H.Y., Shi, F.G., Lopatin, S., Shacham-Diamand, Y., Zhao, B., Brongo, M., Vasudev, P.K.

Electrochemical Society
10 Conference Proceedings * SOLID PHASE EPITAXIAL RECRYSTALLIZATION OF SOS, WITH APPLICATIONS TO SUBMICROMETER CMOS AND BIPOLAR DEVICES

Vasudev, P.K.

Materials Research Society
5 Conference Proceedings Compatibility of Low Dielectric Constant Poly (arylether) with the Electroless Copper Deposition Solution

Hsu, D., Iskander, M., Tong, H.Y., Shi, F., Lopatin, S., Shacham-Diamand, Y., Zhao, B., Brongo, M., Vasudev, P.K.

Electrochemical Society
11 Conference Proceedings Process of CoPt Alloys Electrodeposition for MEMS/NEMS Applications

O. Berkh, Y. Shacham-Diamand, E. Gileadi

Electrochemical Society
6 Conference Proceedings Conformal Electroless Copper Deposition for sub-0.5 μm Interconnect Wiring of Very High Aspect Ratio

Lopatin, S., Shacham-Diamond, Y., Dubin, V.M., Vasudev, P.K., Zhao, B., Pellerin, J.

Electrochemical Society
12 Conference Proceedings Electroless Deposition of Silver and Silver-Tungsten Films for Microelectronics and MEMS Applications*

Shacham-Diamand, Y., Inberg, A., Sverdlov, Y., Croitoru, N.

Electrochemical Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12