Dielectric CMP Planarization Considerations for Deep Sub-Micron Multilevel Interconnect Processes
- Author(s):
- Publication title:
- Proceedings of the First International Symposium on Chemical Mechanical Planarization
- Title of ser.:
- Electrochemical Society Proceedings Series
- Ser. no.:
- 96-22
- Pub. Year:
- 1996
- Page(from):
- 197
- Page(to):
- 205
- Pages:
- 9
- Pub. info.:
- Pennington, NJ: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566771726 [1566771722]
- Language:
- English
- Call no.:
- E23400/970318
- Type:
- Conference Proceedings
Similar Items:
Electrochemical Society |
Electrochemical Society |
Electrochemical Society |
Materials Research Society |
3
Conference Proceedings
Optimizing Sputtered TiN Arc Film Properties for Lithography of Sub-0.25 ヲフm Interconnect
MRS - Materials Research Society |
Electrochemical Society |
4
Conference Proceedings
Optimization of a Chemical Mechanical Polishing Process for Dielectric Planarization
Electrochemical Society |
10
Conference Proceedings
Process Windows of Nickel and Platinum Silicides in Deep Sub-Micron Regime
MRS - Materials Research Society |
5
Conference Proceedings
Analysis of Copper and Low-K Dielectric Interconnect System for 0.18-ヲフm Technology
MRS - Materials Research Society |
11
Conference Proceedings
Contact and Spacer Etch Dependent Junction Leakage in Sub-Micron CMOS Technology
Electrochemical Society |
Electrochemical Society |
12
Conference Proceedings
Observation of the Full Interface of Multilevel Interconnects for Sub-Half-Micron Devices
MRS - Materials Research Society |