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Optimization of the Chemical Mechanical Planarization Process to Build Multilevel Copper Interconnection Structures

Author(s):
Murarka, S.P.  
Publication title:
Proceedings of the First International Symposium on Chemical Mechanical Planarization
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
96-22
Pub. Year:
1996
Page(from):
121
Page(to):
136
Pages:
16
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566771726 [1566771722]
Language:
English
Call no.:
E23400/970318
Type:
Conference Proceedings

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