Metallization And Packaging of Compound Semiconductor Devices at Sandia National Laboratory

Author(s):

• Seigal, P.K
• Armendariz, M.G.
• Rieger, D.J.
• Lear, K.L.
• Sullivan, C.T

Publication title:

Proceedings of the Symposium on High Speed III-V Electronics for Wireless Applications and the twenty-fifth State-of-the-Art Program on Compound Semiconductors (SOTAPOCS XXV)

Title of ser.:

Electrochemical Society Proceedings Series

Ser. no.:

96-15

Pub. Year:

1996

Page(from):

158

Page(to):

168

Pub. info.:

Pennington, NJ: Electrochemical Society

ISSN:

01616374

ISBN:

9781566771658 [156677165X]

Language:

English

Call no.:

E23400/963435

Type:

Conference Proceedings