Remote Microwave Plasma Enhanced CVD of Low Dielectric Constant SiOxFy Films From FASi-4 and Oxygen
- Author(s):
Virmani, M. Jin, Z. Leusink, G.J. Raupp, G.B. Cale, T.S. Laxman, R.K. Hochberg, A.K. - Publication title:
- Proceedings of the Thirteenth International Symposium on Chemical Vapor Deposition
- Title of ser.:
- Electrochemical Society Proceedings Series
- Ser. no.:
- 96-5
- Pub. Year:
- 1996
- Page(from):
- 869
- Page(to):
- 878
- Pages:
- 10
- Pub. info.:
- Pennington, NJ: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566771559 [1566771552]
- Language:
- English
- Call no.:
- E23400/962104
- Type:
- Conference Proceedings
Similar Items:
Electrochemical Society |
kluwer Academic Publishers |
Trans Tech Publications |
Electrochemical Society |
Electrochemical Society |
9
Conference Proceedings
MECHANISM OF PLASMA-ENHANCED DEPOSITION OF SILICON DIOXIDE FROM TEOS/O2 MIXTURES
Materials Research Society |
Materials Research Society |
10
Conference Proceedings
A MODEL FOR STEP COVERAGE IN PLASMA-ENHANCED DEPOSITION OF SILICON DIOXIDE FROH TEOS
American Institute of Chemical Engineers |
Materials Research Society |
Materials Research Society |
American Institute of Chemical Engineers |
12
Conference Proceedings
Low-Dielectric Constant SiO(F,C) Films for ULSI Interconnections Prepared by CF4 Plasma Ion Implantation
MRS - Materials Research Society |