Blank Cover Image

Development of a Low Current Dsnsity Electroplating Bath for Fabrication of CoNiFe Thin Fikms

Author(s):
Publication title:
Proceedings of the Fourth International Symposium on Magnetic Materials, Processes, and Devices : applications to storage and microelectromechanical systems (MEMS)
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
95-18
Pub. Year:
1995
Page(from):
543
Page(to):
551
Pages:
9
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566771139 [1566771137]
Language:
English
Call no.:
E23400/961821
Type:
Conference Proceedings

Similar Items:

1 Conference Proceedings High Current Integrated Microinductors and Microtransformers Using Low Temperature Fabrication Processes

Park,Jae Y., Allen,Mark G.

SPIE-The International Society for Optical Engineering
7 Conference Proceedings Trench And Via Filling With Electroplated Copper: Effect Of Current Density And Pulse Waveform

Seah, C., Mridha, S., Siew, Y., Sarkar, G., Chan, L.

Materials Research Society
2 Conference Proceedings Magnetic Properties of Electroplated CoNiFe Alloys

Medina, J.A., Jiang, T., Dinan, T.

Electrochemical Society
8 Conference Proceedings Bath Additive and Current Density Effects on Copper Electroplating Fill of Cu Damascene Structures

Mikkola, R. D., Jiang, Q-T., Carpio, R., Carpenter, B.

MRS - Materials Research Society
3 Conference Proceedings Fabrication of Electroplated Nickel Micromechanical Comb Resonators

Ravokilde, J.T., Yalcinkaya, A.D., Johansen, L.S., Hansen, O.

Electrochemical Society
9 Conference Proceedings Bath Additive and Current Density Effects on Copper Electroplating Fill of Cu Damascene Structures

Carpenter, B., Carpio, R., Jiang, Q-T., Mikkola, R. D.

Materials Research Society
4 Conference Proceedings Pulsed Electrodeposition of Soft Magnetic CoNiFe Thin Films

Nakanishi, T., Ozaki, M., Nam, H.-S., Yokoshima, T., Osaka, T.

Electrochemical Society
10 Conference Proceedings (202d) Design and Fabrication of High-Performance Electrodes for Li-Ion Batteries Based on Sequential Multilayer Electroplating

Andac Armutlulu, Sue Ann Bidstrup Allen, Mark G. Allen

American Institute of Chemical Engineers
5 Conference Proceedings Mechanical properties of electroplated copper thin films

Spolenak, R., Volkert, C. A., Takahashi, K., Fiorillo, S., Miner, J., Brown, W. L.

MRS-Materials Research Society
11 Conference Proceedings (202d) Design and Fabrication of High-Performance Electrodes for Li-Ion Batteries Based on Sequential Multilayer Electroplating

Andac Armutlulu, Sue Ann Bidstrup Allen, Mark G. Allen

American Institute of Chemical Engineers
6 Conference Proceedings Microstructure and Mechanical Properties of Electroplated Cu Thin Films

Voinsky, A.A., Vella, J., Adhihetty, I.S., Sarihan, V., Mercado, L., Yeung, B.H., Gerberich, W.W.

Materials Research Society
12 Conference Proceedings Room Temperature Recrystallization Of Electroplated Copper Thin Films: Methods And Mechanisms

Walther, D., Gross, M.E., Evans-Lutterodt, K., Brown, W.L., Oh, M., Merchant, S., Naresh, P.

Materials Research Society
1
 
2
 
3
 
4
 
5
 
6
 
7
 
8
 
9
 
10
 
11
 
12