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Analysis of Process-Induced Stresses in Lateral Trench Isolation Structures for High Voltage Devices in Bonded SOI Wafers

Author(s):
Baumgart, H.
Letavic, T.J.
Wolf, I.De.
Tsou, L.
Maes, H.E.
Egloff, R.
1 more
Publication title:
Proceedings of the Third International Symposium on Semiconductor Wafer Bonding : physics and applications
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
95-7
Pub. Year:
1995
Page(from):
440
Page(to):
454
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566771016 [1566771013]
Language:
English
Call no.:
E23400/952067
Type:
Conference Proceedings

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