Boron Present in the Interface of Bonded SOI Wafers and its Protection Method
- Author(s):
- Publication title:
- Proceedings of the Third International Symposium on Semiconductor Wafer Bonding : physics and applications
- Title of ser.:
- Electrochemical Society Proceedings Series
- Ser. no.:
- 95-7
- Pub. Year:
- 1995
- Page(from):
- 96
- Page(to):
- 106
- Pub. info.:
- Pennington, NJ: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566771016 [1566771013]
- Language:
- English
- Call no.:
- E23400/952067
- Type:
- Conference Proceedings
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