Recent Advances in Thinning of Bonded SOI Wafers by Plasma-Assisted Chemical Etching
- Author(s):
- Publication title:
- Proceedings of the Third International Symposium on Semiconductor Wafer Bonding : physics and applications
- Title of ser.:
- Electrochemical Society Proceedings Series
- Ser. no.:
- 95-7
- Pub. Year:
- 1995
- Page(from):
- 28
- Page(to):
- 32
- Pub. info.:
- Pennington, NJ: Electrochemical Society
- ISSN:
- 01616374
- ISBN:
- 9781566771016 [1566771013]
- Language:
- English
- Call no.:
- E23400/952067
- Type:
- Conference Proceedings
Similar Items:
Electrochemical Society |
7
Conference Proceedings
Aspheric surface figuring of silicon using plasma-assisted chemical etching
Society of Photo-optical Instrumentation Engineers |
Electrochemical Society |
Materials Research Society |
Electrochemical Society |
Society of Photo-optical Instrumentation Engineers |
Electrochemical Society |
SPIE-The International Society for Optical Engineering |
Electrochemical Society |
Electrochemical Society |
6
Conference Proceedings
Plasma Enhanced CVD and Plasma Chemical Etching at Atmospheric Pressure for Continuous Processing of Crystalline Silicon Solar Wafers
Society of Vacuum Coaters |
Electrochemical Society |