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The Design of a Test Chip for a Sematech Program to Standardize Electromigration Testing

Author(s):
Publication title:
Proceedings of the Symposium on Reliability of Metals in Electronics
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
95-3
Pub. Year:
1995
Page(from):
116
Page(to):
125
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566770972 [1566770971]
Language:
English
Call no.:
E23400/952063
Type:
Conference Proceedings

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