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Improved Within-Wafer Uniformity Modeling Through ihe Use of Maximum-Likelihood Estimation of the Mean and Covariance Surfaces

Author(s):
Publication title:
Proceedings of the Symposium on Process control, Diagnostics, and Modeling in Semiconductor Manufacturing
Title of ser.:
Electrochemical Society Proceedings Series
Ser. no.:
95-2
Pub. Year:
1995
Page(from):
412
Page(to):
423
Pages:
12
Pub. info.:
Pennington, NJ: Electrochemical Society
ISSN:
01616374
ISBN:
9781566770965 [1566770963]
Language:
English
Call no.:
E23400/952062
Type:
Conference Proceedings

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