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The study of phase angle effects to wafer process window using 193-nm EAPSM in a 300-mm wafer manufacturing environment

Author(s):
Chou, W.Y. ( United Microelectronics Corp. (Taiwan) )
Yen, S.M. ( United Microelectronics Corp. (Taiwan) )
Wu, J.K. ( United Microelectronics Corp. (Taiwan) )
Shieh, W.B. ( United Microelectronics Corp. (Taiwan) )
Chuang, M. ( DuPont Photomasks Taiwan Ltd. (Taiwan) )
Fan, G. ( DuPont Photomasks Taiwan Ltd. (Taiwan) )
Tseng, C.C. ( DuPont Photomasks Taiwan Ltd. (Taiwan) )
Hughes, G.P. ( DuPont Photomasks, Inc. (USA) )
MacDonald, S.S. ( DuPont Photomasks, Inc. (USA) )
Holiday, C. ( DuPont Photomasks, Inc. (USA) )
Chen, G. ( DuPont Photomasks, Inc. (USA) )
6 more
Publication title:
Photomask and Next-Generation Lithography Mask Technology XI
Title of ser.:
Proceedings of SPIE - the International Society for Optical Engineering
Ser. no.:
5446
Pub. Year:
2004
Page(from):
615
Page(to):
623
Pages:
9
Pub. info.:
Bellingham, Wash.: SPIE - The International Society of Optical Engineering
ISSN:
0277786X
ISBN:
9780819453693 [0819453692]
Language:
English
Call no.:
P63600/5446.2
Type:
Conference Proceedings

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