The study of phase angle effects to wafer process window using 193-nm EAPSM in a 300-mm wafer manufacturing environment
- Author(s):
Chou, W.Y. ( United Microelectronics Corp. (Taiwan) ) Yen, S.M. ( United Microelectronics Corp. (Taiwan) ) Wu, J.K. ( United Microelectronics Corp. (Taiwan) ) Shieh, W.B. ( United Microelectronics Corp. (Taiwan) ) Chuang, M. ( DuPont Photomasks Taiwan Ltd. (Taiwan) ) Fan, G. ( DuPont Photomasks Taiwan Ltd. (Taiwan) ) Tseng, C.C. ( DuPont Photomasks Taiwan Ltd. (Taiwan) ) Hughes, G.P. ( DuPont Photomasks, Inc. (USA) ) MacDonald, S.S. ( DuPont Photomasks, Inc. (USA) ) Holiday, C. ( DuPont Photomasks, Inc. (USA) ) Chen, G. ( DuPont Photomasks, Inc. (USA) ) - Publication title:
- Photomask and Next-Generation Lithography Mask Technology XI
- Title of ser.:
- Proceedings of SPIE - the International Society for Optical Engineering
- Ser. no.:
- 5446
- Pub. Year:
- 2004
- Page(from):
- 615
- Page(to):
- 623
- Pages:
- 9
- Pub. info.:
- Bellingham, Wash.: SPIE - The International Society of Optical Engineering
- ISSN:
- 0277786X
- ISBN:
- 9780819453693 [0819453692]
- Language:
- English
- Call no.:
- P63600/5446.2
- Type:
- Conference Proceedings
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